Apparatus including a wire tipped probe for testing semiconductor wafers

ABSTRACT

An apparatus for sequentially testing devices on a semiconductor wafer comprising a support column including means for receipt of a removable platform on which a wafer to be tested is mounted. A plurality of probes are disposed about the support column. The probes have a bird-beaklike shape and are thin in comparison to their width, whereby a large number of probes can be disposed in circular array around the support column.

United States Patent William Lee Oates Somerset, NJ.

[21 Appl. No. 819,828

[22] Filed Apr. 28, 1969 Division ofSer. No. 651, 5,.1uly 7,1967, Pat.No. 3,453,545

Aug. 10, 1971 RCA Corporation [72] inventor [45] Patented 73] Assignee[54] APPARATUS INCLUDING A WIRE TIPPED PROBE FOR TESTING SEMICONDUCTORWAFERS 2 Claims, 16 Drawing Figs.

[52] U.S.Cl 324/158 P, 324/725, 324/149, 339/108 TP [51] Int. Cl. ..G01r31/22, GOlr 31/02 [50] Field 01 Search 324/158,

158 P, 158 F, 72.5, 149; 274/23, 38; 200/166 B, 166 BB, 166 BG. 166 C;29/630; 339/108 R, 108 TP,109, 110, 252 R, 252 P, 176 MP (56] ReferencesCited UNITED STATES PATENTS 430,278 1890 Edison 274/38 X 1,211,559 1917Lany 274/38 2,239,359 1941 Banning 274/23 3,011,792 1961 Demaree et a1274/-23 OTHER REFERENCES Graner et 211.; Electrical Probe; IBM Tech.Dis, Bulletin; vol. 8; no. 12; May 1966; pages 1722, 1723, 1724; copy in324 158 Primary ExaminerRudolph V. Rolinec Assistant Examiner- Ernest F.Karlsen Attorney-G, H. Bruestle ABSTRACT: An apparatus for sequentiallytesting devices on a semiconductor wafer comprising a support columnincluding means for receipt of a removable platform on which a wafer tobe tested is mounted. A plurality of probes are disposed about thesupport column. The probes have a bird-beaklike shape and are thin incomparison to their width, whereby a large number of probes can bedisposed in circular array around the support column.

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y ATTORNEY PATENIED AUG! 01971 I N YEN TOR mu MM 1 04 755 APPARATUSINCLUDING A WIRE TIPPED PROBE FOR TESTING SEMICONDUCTOR WAFERSCROSS-REFERENCE TO RELATED APPLICATION This is a divisional applicationof copending application Ser. No. 651,885, filed July 7,1967, now U.S.Pat. No. 3,453,545.

BACKGROUND OF THE INVENTION In the manufacture of semiconductor devices,e.g., integrated circuit devices, it is the practice to provide rows andcolumns of spaced and discrete semiconductor device pellets, or devices,on a single semiconductor wafer, test the devices individually foroperability, and thereafter dice the wafer into individual semiconductordevice pellets.

Each device includes a plurality of metal surface contacts by means ofwhich the device can be electrically connected to terminals of thedevice envelope. In the testing of the devices on the wafer, the devicesare successively tested by contacting each of the metal contacts of eachdevice with a different test probe of a probing assembly.

The devices are small and fragile. A representative 24 contact device,for example, measures 73 by 73 mils, and has six contacts disposed alongeach side thereof on mil centers. The contacts comprise thin metaldepositions having a thickness in the order of 7,000 Angstroms, andmeasure 4 by 4 mils. Prior art apparatuses are incapable of testing such24 contact devices because, owing to the arrangement of the contacts andthe close spacing therebetween, insufficient space is available topermit engagement of each contact with a prior art probe withoutmechanical and electrical interference of the probes with one another. Afurther problem with prior art apparatus is that it has been foundextremely difficult to obtain reproducibility and accuracy of the testreadings. This occurs because of the prior art difficulty of engagingthe probes with the device contacts with uniform and reproduciblepressure; because of the difficulty ofmaintaining the probes with auniform sharpness; and because of the difficulty of providing exactrepositioning of each probe after engagement with a device to ensureproper engagement of the probes with the contacts of successive devices.Another problem has been the difficulty of obtaining a positiveelectrical engagement of the sharp probe tips with the contacts whileavoiding wide variations in electrical resistance and damage to the thinmetal contacts. A still further problem is that of the excessive periodof time involved in mounting the wafer to be tested on the probeapparatus in precise registry with the probes. The prior art wafermounting process causes a significant reduction in machine efficiency.

SUMMARY OF THE INVENTION Apparatus is provided comprising a platform onwhich the wafer to be tested is mounted, a plurality of probes forengaging each contact of the wafer devices, means for mounting theprobes, and means for indexing the platform and the probe mounting meansrelative to one another for successively engaging the contacts of eachwafer device with the probes. The wafer platform includes simple andprecise means for mounting the platform in identical, preselectedorientation at two or more operating stations, whereby a wafer can bemounted on the platform in precise orientation with respect to theprobes on the probing apparatus while-the platform is removed from theapparatus. This reduces the-downtime of the probing apparatus.

Each probe comprises a curved pointed member having a decreasing widthand thickness towards the pointed end of the probe. In one embodiment, afinewire is strung along the edge of the probe and around the probepoint. In operation, the portion of the wire curved around the probepoint serves as the contact engaging tip" of the probe. The sharpness ofthe probe tip" is determined by the diameter of the wire and the profileradius or sharpness of the probe points. Since both these factors arecontrollable to a high degree of accuracy, probes having uniform tipsharpness are readily obtained. Upon wear of the wire, the probe isreadily restrung with another wire.

In another embodiment, a small metal ball is mounted on the point of theprobe. The ball serves as the probe tip." The size of the ball, which isaccurately controllable, determines the sharpness of the probe tip. Theball is readily replaceable upon wear.

The probe mounting means includes means for precisely registering eachprobe tip with its respective device contacts upon successive indices ofthe apparatus, and includes means for allowing substantially uninhibitedmovement of the probes with the wafer upon engagement of the probe tipswith the contacts. This avoids scraping and damaging of the contacts bythe probe tips. Means are provided to determine if all the probe tipshave engaged their respective contacts, and means are provided forvibrating the wafer supporting platform in a direction perpendicular tothe plane of the wafer for causing penetration of the probe tips throughany electrically insulating films covering the device contacts.

BRIEF DESCRIPTION OF THE DRAWING FIG. 1 is a plan view of asemiconductor wafer;

FIG. 2 is an enlarged view of the wafer, showing a single devicethereon;

FIG. 3 is a side elevation, partly broken away, of apparatus accordingto the present invention;

FIG. 4 is a view in perspective ofa probe of the apparatus of FIG. 3;

FIG. 5 is a side elevation showing a modification of the probe shown inFIG. 4;

FIG. 6 is a plan view of a probe support arm of the apparatus of FIG. 3;

FIG. 7 is a side elevation of the probe support arm;

FIG. 8 is a side elevation, partly in section of a probing mechanism;

FIG. 9 is a plan view of the probing mechanism;

FIG. 10 is a section along line 10-l0 of FIG. 9;

FIG. 11 is a bottom view of the wafer supporting platform;

FIG. 12 is a side view of the wafer supporting platform;

FIG. 13 is a section along line 13-13 of FIG. 11;

FIG. 14 is a plan view of the platform supporting fixture;

FIG. 15 is a section along line 15-15 of FIG. 14; and

FIG. 16 is a view similar to FIG. 14 but illustrating the mounting ofthe wafer supporting platform on the fixture.

DESCRIPTION OF A PREFERRED EMBODIMENT General Description A waferworkpiece 6 of the type which can be tested on the probing apparatus ofthe present invention is shown in FIG. I. The wafer 6 is a thin disc ofa semiconductor material, e.g. silicon, having orthogonal rows andcolumns of spaced semiconductor devices 7 thereon. As shown in FIG. 2,each device 7 has a plurality of metal contacts 8 which are electricallyconnected to various components, not shown, on the device. In thetesting of each device 7 on the wafer 6, electrical contact is made bymeans of a plurality of test probes with the plurality of contacts ofthe device being tested, and electrical signals are applied to thedevice through the probes. In some instances, the contacts 8 comprise adeposit of aluminum, which acquires a surface film or coating ofaluminum oxide. For low electrical resistance contacting of the testprobes with the device contacts, it is desirable that the probespenetrate the aluminum oxide film.

With reference to FIG. 3, a general description of an apparatusembodying the present invention is given. The apparatus comprises a baseplate 10 on which are mounted four (only two of which are shown) equallyspaced support columns 11. Mounted on the columns 11 is a probingassembly 12 comprising an annular plate 13 having a plurality of probingmechanisms mounted thereon. Two probing mechanisms 15 are shown. In thisembodiment, 24 radially extending probing mechanisms 15, spaced aroundthe central opening in the annular plate 13, are used.

Each probing mechanism 15 comprises an inwardly extending probe 17mounted on a support arm 18 which is mounted, in turn, on a supportplatform 20. The inner ends or tips 21 of the probes 17 are disposed inan array corresponding to the array of contacts on each wafer device.

The probing assembly 12 is accurately and removably mounted on thecolumns 11 by means of V blocks 24 secured to the underside of the plate13. The V blocks 24 rest on and are accurately positioned by dowels 25which rest in and are accurately positioned by V grooves 26 on the topof the columns 11. The probing assembly 12 is held in place solely byits own weight and can be lifted off the columns for adjustment orreplacement.

Extending upwardly through the opening in the annular plate 13 is aworkpiece supporting column 28 mounted on an indexing mechanism 30. Themechanism 30 serves the function of sequentially indexing the column 28in orthogonal directions.

Included within the column 28 is a means for causing vertical vibrationof the column. Such means can comprise, for example, a verticallymounted iron-cored solenoid 31 having a magnetic, spring biased hammer32 associated therewith. Energization of the solenoid by means of anelectrical pulse generating system of known type causes the hammer tostrike the core at a controlled rate, duration, and force. The impulsesare transmitted through the solenoid core to the column 28.

Mounted on top of the column 28 is a fixture 36 on which is removablymounted a platform 34. A wafer 6 to be tested is mounted on the platform34, the wafer being disposed, in a manner described hereinafter, inaccurate angular and lateral alignment with the probing assembly 12 andthe directions of index of the indexing mechanism 30.

Also included within the supporting column 28 is a means for lifting orraising the fixture 36 on which the wafer carrying platform 34 ismounted. Such means can comprise, for example, a vertically disposed aircylinder 37 having a piston 38 upon which the fixture 36 is mounted.Elongated vertically disposed bearings (not shown) are preferably usedto provide exact vertical up and down movement of the fixture 36 uponactuation of the air cylinder 37.

In operation of the apparatus, the lifting means raises the wafer intocontact with the tips 21 of the probes 17. Each probe tip 21 engages adifferent contact of one of the devices 7 on the wafer, and the column28, with the wafer thereon, is vertically vibrated to cause the probetips to penetrate any electrically insulating films covering thecontacts for the purpose of making low electrical resistance engagementwith the contacts. Electrical signals are applied to the device throughthe probes 17 by means, not shown, and the device is electricallytested. If electrically unsatisfactory, the device is marked, e.g., byan ink drop provided by a known type hypodermic needle type marker (notshown) mounted on the probing assembly. Thereafter, the wafer is loweredand the indexing mechanism 30 indexes the wafer support column to aligna new device with the probe assembly. The wafer is again lifted and thenewly aligned device is tested.

Various portions of the above-described apparatus, such as theelectrical testing means and the indexing mechanism are generally known.

For example, the testing means can comprise the Automatic integratedCircuit Test Set, Model No. 4,000, sold by Fairchild Camera Corporation,Mountain View, California.

The indexing mechanism can comprise, for example, the XY500 Index Table,sold by the Transistor Automatic Corporation, Cambridge, Mass.

Probing Assembly A probe 17 is shown in detail in FIG. 4. The probe 17comprises an elongated member 40 having, in plan, a wedge shape, and acurved pointed tip end 42. Details of the tip end 42 are providedhereinafter. The rear end 44 of the probe 17 includes a block 46 ofinsulating material and a rearwardly extending connector member 52comprising a cylindrical pin 53 having laterally extending flanges 54. Abore 55 is provided extending through the pin 53.

The support arm 18, shown by itself in FIGS. 6 and 7, comprises anelongated tapered member 56 having an opening or receptacle 58 at itsnarrow end 60 for receipt of the connector member 52 of the probe 17.(For convenience of illustration, the probe 17 shown in FIG. 4 is notdrawn to the same scale as the support arm 18 shown in FIGS. 6 and 7.)The receptacle 58 has an axially extending cylindrical portion 62 forreceipt of the cylindrical pin 53 of the connector 52, and a laterallyextending slot 63 for receipt of the flanges 54 of the connector. Aclamp screw 64 is provided for clamping the probe connector 52 firmly inplace within the receptacle 58.

The probe-support arm mounting arrangement described provides anaccurate and precise mounting of each probe 17 on its support mechanismwhile allowing easy removal and replacement of the probes.

Near the front or narrow end 60 of the support arm 18 is a downwardlyextending wedge 65 (FIG. 7) mounted by means of an insulating member 66on the support arm 18. Near the rear or wide end 67 of the arm 18 is amember 68 of a gimbal joint. The member 68 is pivotally mounted betweensets of bearings 69 (FIG. 6) in the arm 18. The purpose of these variousapparatus parts appears hereinafter.

The probe 17 and support arm 18 are shown, in FIGS. 8 and 9, inassembled relation and mounted on the support platform 20. As shown inFIG. 9, the entire probing mechanism 15, in plan, comprises a sector ofacircle having a small included angle. In one embodiment, for example,the included angle of the probing mechanisms is less than 7. Mechanicalstrength for the probes 17 is provided by the relatively large width orheight of the probes. Because of the small included angle of the probingmechanisms 15, a relatively large number of probing mechanisms, e.g., inexcess of 30, can be provided spaced around the annular plate 13.

The prior art probes comprise cylindrical needles which taper to a pointat an angle in the order of 12. Owing to the fact that the needles areused in an inclined position, usually at an angle of 45, the projectionof the probes on the plane of the wafer workpiece has an included anglein the order of 17. This limits the number of probes that can bedisposed in a circular array to about 20. Needle points of smallertaper, that is, of smaller included angle, are generally impractical dueto the requirements of mechanical strength.

With reference to FIG. 8, the support platform 20 comprises a base plate70 which is rigidly mounted on the probe assembly plate 13 by means ofscrews 71. To provide a degree of lateral adjustability of each supportplatform 20, for obtaining precise positioning of each probe withrespect to the workpiece support column 28 (FIG. 3) during setup of theapparatus, a second base plate 74 is provided mounted on the first baseplate 70. The plate 74 is mounted by means of screws 75 and a pin 76secured to the plate 74 at the rear thereof and extending, in slidingfit, into a slot 77 in the plate 70. The slot 77 extends in a radialdirection with respect to the probing assembly annular plate 13.Disposed between the head of each screw 75 and a washer 79 is a siliconO-ring 80. The presence of the O-rings allows friction sliding of theplates 70 and 74 relative to one another after the screws 75 have beentightened. To effect such movement, a removable tool 81, shown inphantom in FIG. 8, having a pair of pivoting balls 83 and 84 thereon, isinserted through a bore 86 through the plate 74 and into a blind bushing88 in the plate 70. Pivoting of the plate 74 about the axis of the pin76, and movement of the plate 74 radially inwardly and outwardly alongthe slot 77, is obtained by tilting of the tool 81.

Mounted on the support plate 74 is an L-shaped member 90 having a set ofbearings 92 therein disposed opposite to a set of bearings 94 in thesupport plate 74. The gimbal member 68 is pivotally mounted between thebearing sets 92 and 94. The bearing sets 92 and 94, the bearing sets 69(FIG. 6) in the support arm 18, and the member 68 constitute a gimbaljoint 96 by means of which the support arm 18 is mounted on the sup portplatform 20. An advantage of this mounting arrangement is describedhereinafter.

For accurately controlling the at rest positioning of each probe 17,that is, the location of the probes when they are not engaged with thewafer 6, a pair of oppositely disposed metal contact balls 98 (see alsoFIG. forming a groove for receiving the wedge 65 on the support arm 18are provided. The balls 98 are accurately positioned in a holder 100mounted on the base plate 74. Preferably, for a reason describedhereinafter, at least one of the balls 98 is electrically insulated fromthe holder 100, as by means of an epoxy cemerit 99 (FIG. 10), and has anelectrical connector wire '98 extending therefrom.

To provide vertical adjustability of the at rest" position of each probe17 during the setup of the probe assembly 12, means are provided forupwardly or downwardly tilting the holder 100 containing the contactballs 98.

As shown in FIG. 8, the holder 100 is an elongated member pivoted at itsrear end 101 about a pin 102 mounted on a bracket (not visible) securedto the base plate 74. A compression spring 103 is provided between theend 101 of the holder 100 and the base plate 74 biasing the holder in acounterclockwise direction. Disposed between the holder 100 and the baseplate 74 is a slidable block 105 having an opening 106 therethrough. Thefront surface 107 of the block 105 is tapered and serves as a wedgewhich acts upon a steel ball 109 secured to the holder 100. Movement ofthe block 105 to the left or right (as viewed in FIG. 8) causesclockwise or counterclockwise tilting, respectively, of the holder 100about the pin 102. To effect such block movement during setup of theprobe assembly, a hollow adjustmenttool 110 is provided. The tool 110comprises an elongated pin 111 which is in threaded engagement with ahollow upwardly extending stud 112 mounted on the base plate 74. Ahollow sleeve 113 having a hollow ball 114 on the end thereof is mountedon the pin 111. The stud 112 extends upwardly through the ball 114 andinwardly of the sleeve 113. Downward screwing of the tool 110 into thestud 112 causes the ball 114 to act against a tapered surface 117 of theblock 105, thereby causing movement of the block to the left and upwardtilting of the holder 100. Upward screwing of the tool 110 allowsmovement of the block 105 to the right and downward tilting of theholder under the influence of the spring 103.

When set up, as described, each probe 17 has an accurately defined atrest position to which the probes return when the probes are disengagedfrom the wafer. This insures a preselected positioning of all the probetips relative to one another and relative to the workpiece supportcolumn 28 for providing proper contact of each probe tip 21 with itsrespective device contacts upon successive indices of the apparatus.

To provide a uniform pressure of the probe tips 21 against the waferdevice contacts, a tension spring 119 is provided secured between thesupport arm 18 and the plate 70.

To ensure positive engagement of the wafer 6 with each of the probes 17,the wafer is raised slightly higher, e.g., 0.002 inch, than the at rest"vertical positioning of the probe tips 21. The wedges 65 on the supportarms 18 are thus lifted from contact with the contact balls 98 on thesupport platform when the wafer is in its fully raised position. Owingto the gimbal mounting of the support arm 18 on the platform 20, and thesmall upward movement of the probes in comparison with the probelengths, the probe tips are substantially completely free to follow themovement of the wafer. An advantage of this is that once contact betweenthe wafer and the probe tips is made, there is substantially no relativemovement therebetween. This prevents scratching of the thin metallizeddevice contacts.

As described, the wedges 65 and one of the contact balls 91: areelectrically insulated from their respective mounting means. Thus, byuse of known electrical circuit means connected between the wedges andinsulated balls, the lifting of the wedges 65 from contact with theballs 98 provides an accurate and simple means for indicating positiveengagement of each probe 17 with the wafer 6.

Further details of the tip ends 42 of the probes 17 are now given. Withreference to FIG. 4, the tip end 42 of the probe tapers in width tosubstantially a point 120 having, for example, a radius of curvature inthe order of V2 mil, and tapers to a small thickness in the order, forexample, of2 to 3 mils.

Two rods 121 are press fitted within bores in the probe member 40 andhave outwardly extending cantilevered ends 123. A fine wire 126 ofa hardmaterial, such as tungsten, extends along the edges 128 and 130 of theprobe and around the point 120 of the probe. The ends of the wireterminate in loops which are looped around the rod ends 123. The rods121 serve as tensioned springs to maintain the wire 126 under tension.With a 1 mil diameter wire 126 sharply bent around the point 120 of theprobe, a probe tip 21 having a radius of curvature of 1% mils withpractically no tolerance is provided.

To facilitate threading of the wire 126 around the probe point 120, andfor maintaining the wire in place, a fine tubing 132 is attached, as bysolder, to the lower edge 130 of the probe. Also, although notillustrated, small grooves are preferably provided along the probe edges128 and 130 to help retain the wire 126 in place.

In use of the probe 17, only the portion of the wire 126 curved aroundthe probe point 120 engages the device contacts and only the wire issubject to wear. Since fine wires 126, such as, for example, the 1 mildiameter tungsten wire used in the present embodiment, can be drawn to ahigh degree of precision, and since the probe tip ends 42 can bemachined to a high degree of accuracy, a high degree of accuracy anduniformity of sharpness of the probe tips 21 is obtainable. The tungstenwire is hard and wears well. When excessive wear of the wire does occur,the wire is readily replaced in a simple threading operation.

An advantage of the fact that the sharpness of the probe tips is readilycontrollable is that each device is tested under uniform test conditionsof probe pressure and engagement area, whereby accurate and reproducibletest results are obtained.

Preferably, for reasons of low and uniform electrical resistance, thetip end 42 of the probe, which can be made from hard machine steel, isplated with a thin plating of gold on top of a thin plating of copper. Aconnector wire 134 is secured to the probe 17 by means of a cap 135press fitted onto the end of a rod 136 mounted on the probe member 40.The wire 134 is connected to the electrical testing means, not shown.

In another embodiment, illustrated in FIG. 5, the probe contacting tip"21 comprises a small ball 139 of a hard and corrosion resistant materialmounted, as by soldering, on the probe point 120. In one embodiment, a0.002 inch diameter iridium ball is used. Other metals, such as varioushard alloys of the noble metals can be used. To facilitate the mountingof the ball 139 on the probe point 120', the point is preferablyprovided with a small flat. The ball 139 provides a tip 21' having anaccurate radius of curvature, and the ball is readily replaceable uponwear.

Wafer Mounting In operation of the probing apparatus, a wafer 6 to betested is mounted on the wafer platform 34 (FIG. 3) which is mounted, inturn, on a fixture 36 secured to the workpiece supporting column 28.

The wafer platform 34, shown in FIGS. 11, 12, and 13, comprises acircular member having a flat upper surface 142 (FIG. 12) for receipt ofthe wafer 6, and an undersurface 144 on which is mounted three steelbearing balls 146, 147, and 148. As described below, a high degree ofaccuracy of neither the dimension of the balls nor their positioning onthe undersurface 144 is required, the balls nevertheless providinghighly accurate lateral and angular orientation of the platform 34 onthe fixture 36.

A convenient way of positioning the bearing balls 146, 147, and 148 onthe surface 144 is to drill three bores 150 (one of which is shown inFIG. 13) in the undersurface 144, allow the balls to be gravity centeredon the bores 150, and solder or braze the balls in place.

For accurately controlling the vertical positioning of the upper surface142 of the platform 34 with respect to the fixture 36, a peripheralportion 152 of the undersurface 144 of the platform is ground flat, theportion 152 thus serving as a bearing ring.

To protect the bearing balls 146, 147, and 148 against damage duringhandling of the platform 34, steel inserts 154 are provided on theundersurface 144.

The fixture 36, shown in FIGS. 14, 15, and 16, comprises a cylindricalmember 156 (see also FIG. 3) having a flat upper surface 157 surroundedby a ring bearing 158 having a flat upper surface. Accurately positionedon the fixture upper surface 157 is an L-shaped block 159 having legs160 and 161. Each leg 160 and 161 has a flat side surface 162 and 163,respectively, which are perpendicular to the upper surface 157. The leg160 is further provided with a semicircular groove 165 to provideclearance for receipt of the middle ball 147 (FIG. 16) of the platform34. A latch arm 167 is provided on the upper surface 157, the arm 167being pivotally mounted on a pin 168 and being biased by a spring, notshown, in a direction towards the leg 160. As shown in FIG. 15, the side169 of the arm 167 is angled inwardly in a direction towards the surface157.

in the mounting of the platform 34 on the fixture 36, the platform isroughly aligned by eye with the fixture and pressed thereon. The middleball 147 on the platform enters the groove 165 (FIG. 16) in the leg 160and forces the arm 167 outwardly against its spring bias. The arm 167applies pressure against the middle ball 147 at an angle of about 45 tothe leg 160, whereby the ball 146 is pressed against the side 162 of theleg 160, and the ball 148 is pressed into contact with the sides 162 and163 of the two legs 160 and 161, respectively. The middle ball 147 doesnot engage the wall of the groove 165. The three point engagement of theballs 146 and 148 with the side surfaces of the legs 160 and 161provides a particular and positive lateral and angular orientation ofthe platform relative to the fixture 36. The angled side surface 169 ofthe arm 167 additionally provides a downward force against the middleball 147, thereby firmly pressing the bearing surface 152 on theplatform 34 downwardly against the bearing 158 on the fixture 36. Thislocks the platform 34 on the fixture 36 in parallel relation therewith.

In use of the platform 34 and fixture 36 combination, a first fixture 36is disposed at an operating station removed from the probing apparatusin preselected lateral and angular orientation with respect to, forexample the cross hairs of a machinists microscope. A second fixture 36is disposed on the probing apparatus. The lateral and angularorientation of the second fixture with respect to the axes ofindex ofthe indexing mechanism on the probing apparatus is identical to thelateral and angular orientation of the first fixture with respect to themicroscope cross hairs. The fixtures are preferably made with a highdegree of accuracy, whereby substantially identical orientation of thetwo fixtures is obtained.

A platform 34 is then snapped in place on the first fixture 36. Asdescribed above, the two balls 146 and 148, even in the absence of closedimensional control thereover, provide a particular and definite lateraland angular orientation of the platform 34 with respect to the fixture36. A wafer 6 is then placed on the platform 34 and a particular row andcolumn of the wafer devices are aligned with the cross hairs of themicroscope. This provides proper lateral and angular orientation of thewafer. The wafer is then secured, as with wax, to the platform. Theplatform is then transferred to the fixture 36 on the probing apparatus.When snapped in place, the two balls 146 and 148 of the platform arepressed firmly against the legs and 161 of the fixture on the probingapparatus. The platform is thus oriented relative to the fixture on thepro bing apparatus in the identical lateral and angular orientation ithad relative to the first fixture. The rows and columns of waferpatterns are thus automatically aligned with the axes of index of theindexing mechanism 30, and the contacts ofa first wafer device areregistered with the tips 21 of the various probes 17.

lt will be appreciated that, generally, a far larger number of platforms34 than fixtures 36 are used. The platforms, which are not fabricatedwith a high degree of accuracy, are relatively inexpensive. The highlyaccurate fixtures, although comparatively expensive, are few in number.The capital expense associated with the use of platform-fixturecombination, therefore, is relatively small.

Operation in use of the apparatus described, a platform 34, having awafer 6 to se tested thereon, is snapped in place on the fixture 36 onthe support column 28. This automatically laterally and angularly alignsthe wafer with the probing assembly 12 and the axes of index of theindexing mechanism 30, as described. Although not described, mechanismsof known type are preferably incorporated in the probing apparatus tomake its operation automatic. Thus, after the platform 34 is mounted inplace, the apparatus is activated and the air cylinder 37 in thesupporting column 28 is actuated to lift the wafer 6 into contact withthe tips 21 of the probes 17 of the various probing mechanisms 15. Ifall the probes 17 are engaged and lifted by the wafer, the separation ofall the support arm 18 wedges 65 from the contact balls 98 produces asignal which causes activation of the vibrating mechanism 31 in thesupport column 28 for a preselected period of time.

The vibration of the wafer 6 provides an important advantage over theprior art apparatus. In the prior art apparatus, positive electricalcontact between the probe tips and the wafer contacts through anyelectrically insulating films on the contacts in obtained by providingrelative lateral movement between the probe tips and the wafer contactsduring the initial contacting therebetween. This causes the probe tipsto tear or gouge through the films. This, i has been found, tends tocause damage of the thin metallic contacts and, further, producesnonuniform and nonreproducible test results.

In the present apparatus, vertical vibration of the wafers causespenetration of the probe tips through the contact coating films in acontrolled uniform fashion. The test data obtained is reproducible, anddamage to the contacts is avoided. Additionally, because penetration ofthe contact coatings is achieved through a controlled vibration of thewafer rather than by means of a gouging action, the probe tips of thepresent apparatus need not be as sharp as the probes of the prior art.This, in turn, provides lower electrical resistance between the probesand the contacts, which is desirable for obtaining accurate andsensitive testing of the wafer devices.

After vibration of the wafer, the electrical characteristics of thewafer device are measured. If the device is defective, the device ismarked, e.g. by a drop ofink.

After a device on the wafer is tested, the wafer 6 is lowered and theindexing mechanism 30 indexes the column along, e.g., an X axis, adistance equal to the distance between adjacent columns of devices onthe wafer. The wafer is then raised to engage a second wafer device onthe row being tested with the probe tips 21. This cycle is repeateduntil the last device on the row of devices has been tested. Upon asubsequent indexing of the wafer in the X direction, one or more probeswill be disposed beyond the edge of the wafer, hence will not be engagedby and will not be raised by the wafer. The signal thus produced by thefailure of all the support arm wedges 65 to break contact with thecontact balls 98 on the support platform 20 causes the indexingmechanism 30 to index the support column 28 in the Y direction to starta new row of devices. The support column 28 is then successively indexedin the reverse direction until all the devices along the new row aretested. This sequence is repeated until the last device on the wafer hasbeen tested. After several further indices, e.g. four, during which oneor more probes fails to se engaged by the wafer, a signal is producedindicating the completion of testing of all the devices on the wafer.The wafer carrying platform 34 is then replaced to start the cycle anew.

I claim:

1. In a probing apparatus for testing devices on a surface of 1 asemiconductor wafer, a probe comprising, an elongated member having arectangular cross section and decreasing in height and thickness towardsa front end of said member, said front end being bent downwardly fromthe direction of elongation of said member and terminating in a point, acontinuous fine wire extending along the top and bottom sides of saidfront end and around the point thereof to form a replaceable probe tipwhich contacts the wafer under test, the height of said probe beingsubstantially greater than the thickness thereof along substantially theentire length of said probe, and the decreasing thickness of said memberproviding a wedgelike configuration having an included angle of lessthan 17 degrees.

2. In a probing apparatus as in claim 1 including, a probe support, andmeans for accurately disposing said probe in a preselected position withrespect to said probe support comprising a pair of oppositely disposedcontact balls mounted on said probe support and a wedge member mountedon said probe.

2. In a probing apparatus as in claim 1 including, a probe support, andmeans for accurately disposing said probe in a preselected position withrespect to said probe support comprising a pair of oppositely disposedcontact balls mounted on said probe support and a wedge member mountedon said probe.